Integrated Circuit Packaging, Assembly and Interconnections [electronic resource] by William Greig.
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
| Main Author: | |
|---|---|
| Corporate Author: | |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2007.
|
| Edition: | 1st ed. 2007. |
| Subjects: | |
| Online Access: | |
| Format: | Electronic eBook |
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance:
Please contact Reference and Discovery Services via their Contact Form or call them directly at: 517-353-8700 for assistance.